Planning Technology for Preparing High-Entropy Alloys (Solders) of the Cu–Ga–Pb–Sn–Bi System
Viscosity of alloy of the Cu–Ga–Pb–Sn–Bi system of equiatomic composition in a specimen heating regime followed by cooling is determined with the aim of planning technology for preparing ingots of high-entropy solders. Temperature and time dependences are studied for wetting angle and spot diameter...
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Veröffentlicht in: | Metallurgist (New York) 2015-09, Vol.59 (5-6), p.435-440 |
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creator | Chikova, O. A. Tsepelev, V. S. V’yukhin, V. V. Shmakova, K. Yu |
description | Viscosity of alloy of the Cu–Ga–Pb–Sn–Bi system of equiatomic composition in a specimen heating regime followed by cooling is determined with the aim of planning technology for preparing ingots of high-entropy solders. Temperature and time dependences are studied for wetting angle and spot diameter of a steel St3 wetted surface under conditions of combined solder and substrate heating. Ingot and bimetal specimen microstructure obtained as a result of spreading tests is studied metallographically |
doi_str_mv | 10.1007/s11015-015-0123-4 |
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subjects | Alloys Characterization and Evaluation of Materials Chemistry and Materials Science Degassing of metals Materials Science Metallic Materials Metals |
title | Planning Technology for Preparing High-Entropy Alloys (Solders) of the Cu–Ga–Pb–Sn–Bi System |
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