Planning Technology for Preparing High-Entropy Alloys (Solders) of the Cu–Ga–Pb–Sn–Bi System

Planning Technology for Preparing High-Entropy Alloys (Solders) of the Cu–Ga–Pb–Sn–Bi System

Viscosity of alloy of the Cu–Ga–Pb–Sn–Bi system of equiatomic composition in a specimen heating regime followed by cooling is determined with the aim of planning technology for preparing ingots of high-entropy solders. Temperature and time dependences are studied for wetting angle and spot diameter...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Metallurgist (New York) 2015-09, Vol.59 (5-6), p.435-440
Hauptverfasser: Chikova, O. A., Tsepelev, V. S., V’yukhin, V. V., Shmakova, K. Yu
Format: Artikel
Sprache:eng
Schlagworte:
Alloys
Characterization and Evaluation of Materials
Chemistry and Materials Science
Degassing of metals
Materials Science
Metallic Materials
Metals
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Viscosity of alloy of the Cu–Ga–Pb–Sn–Bi system of equiatomic composition in a specimen heating regime followed by cooling is determined with the aim of planning technology for preparing ingots of high-entropy solders. Temperature and time dependences are studied for wetting angle and spot diameter of a steel St3 wetted surface under conditions of combined solder and substrate heating. Ingot and bimetal specimen microstructure obtained as a result of spreading tests is studied metallographically
ISSN:0026-0894
1573-8892
DOI:10.1007/s11015-015-0123-4