Electroluminescent characteristics of InGaAsSb/GaAlAsSb heterostructure Mid-IR LEDs at high temperatures
The electroluminescent characteristics of an InGaAsSb/GaAlAsSb heterostructure LED emitting at 1.85 μm are studied in the temperature range 20–200°C. It is shown that the emission power exponentially drops as P ≅ 0.4exp(2.05 × 10 3 / T ) with a rise in temperature primarily because of an increase in...
Gespeichert in:
Veröffentlicht in: | Technical physics 2011-04, Vol.56 (4), p.520-525 |
---|---|
Hauptverfasser: | , , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The electroluminescent characteristics of an InGaAsSb/GaAlAsSb heterostructure LED emitting at 1.85 μm are studied in the temperature range 20–200°C. It is shown that the emission power exponentially drops as
P
≅ 0.4exp(2.05 × 10
3
/
T
) with a rise in temperature primarily because of an increase in the Auger recombination rate. It is found that band-to-band radiative recombination goes in parallel with recombination through acceptor levels, the latter causing the emission spectrum to broaden. With a rise in temperature, the activation energy of the acceptor levels decreases by the law Δ
E
≅ 32.9 − 0.075
T
and the maximum of the LED’s emission spectrum shifts toward the long-wavelength range (
hν
max
= 0.693 − 4.497 × 10
−4
T
). Based on the dependence
E
g
=
hν
max
− 0.5
kT
and experimental data, an expression is derived for the temperature variation of the bandgap in the In
0.055
Ga
0.945
AsSb active area,
E
g
≅ 0.817 − 4.951 × 10
−4
T
, in the range 290 K <
T
< 495 K. The resistance of the heterostructure decreases exponentially with rising temperature as
R
0
≅ 5.52 × 10
−2
exp(0.672/2
kT
), while cutoff voltage
U
cut
characterizing the barrier height of a
p−n
junction decreases linearly with increasing temperature (
U
cut
= −1.59
T
+ 534). It is found that the current through the heterostructure is due to the generation-recombination mechanism throughout the temperature interval. |
---|---|
ISSN: | 1063-7842 1090-6525 |
DOI: | 10.1134/S1063784211040232 |