Microstructure and properties of a copper electrocontact material with a nanodispersed titanium dioxide additive
The influence of TiO 2 nanopowder additive on the microstructure, physicomechanical properties, and performance characteristics of a copper-based composite is studied. The properties of the composites are compared with those of pure copper compacts. The microstructure and state of the composite’s wo...
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Veröffentlicht in: | Technical physics 2013-05, Vol.58 (5), p.710-714 |
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creator | Zeer, G. M. Zelenkova, E. G. Sidorak, A. V. Ledyaeva, O. N. Kuchinskii, M. Yu |
description | The influence of TiO
2
nanopowder additive on the microstructure, physicomechanical properties, and performance characteristics of a copper-based composite is studied. The properties of the composites are compared with those of pure copper compacts. The microstructure and state of the composite’s working surface after performance tests are examined. It is shown that, when the amount of TiO
2
grows, the hardness of the material rises and the arc quenching effect is enhanced. |
doi_str_mv | 10.1134/S1063784213050253 |
format | Article |
fullrecord | <record><control><sourceid>gale_cross</sourceid><recordid>TN_cdi_gale_infotracacademiconefile_A337071206</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><galeid>A337071206</galeid><sourcerecordid>A337071206</sourcerecordid><originalsourceid>FETCH-LOGICAL-c327t-91e819a125ea318e407dd5705768156b5b5f941aeaaa781c2c333ef9df6c2b0e3</originalsourceid><addsrcrecordid>eNp9UMtKAzEUDaJgrX6Au_zA1NykmceyFF9QcaGuh9vkTk1pJ0OS8fH3ptSdIHdxX-ccOIexaxAzADW_eQFRqqqeS1BCC6nVCZuAaERRaqlPD3OpisP_nF3EuBUCoNblhA1PzgQfUxhNGgNx7C0fgh8oJEeR-44jN37IO6cdmRS88X1Ck_geEwWHO_7p0ntG9dh762JGRrI8uYS9G_fcOv_lbBa21iX3QZfsrMNdpKvfPmVvd7evy4di9Xz_uFysCqNklYoGqIYGQWpCBTXNRWWtroSuyhp0udZr3TVzQELEqgYjjVKKusZ2pZFrQWrKZkfdDe6odX3nU0CTy9LeZQ_UuXxfKFWJCmROZ8rgSDjkEQN17RDcHsN3C6I9ZNz-yThz5JETM7bfUGi3fgx99vUP6QeD94BH</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Microstructure and properties of a copper electrocontact material with a nanodispersed titanium dioxide additive</title><source>Springer Journals</source><creator>Zeer, G. M. ; Zelenkova, E. G. ; Sidorak, A. V. ; Ledyaeva, O. N. ; Kuchinskii, M. Yu</creator><creatorcontrib>Zeer, G. M. ; Zelenkova, E. G. ; Sidorak, A. V. ; Ledyaeva, O. N. ; Kuchinskii, M. Yu</creatorcontrib><description>The influence of TiO
2
nanopowder additive on the microstructure, physicomechanical properties, and performance characteristics of a copper-based composite is studied. The properties of the composites are compared with those of pure copper compacts. The microstructure and state of the composite’s working surface after performance tests are examined. It is shown that, when the amount of TiO
2
grows, the hardness of the material rises and the arc quenching effect is enhanced.</description><identifier>ISSN: 1063-7842</identifier><identifier>EISSN: 1090-6525</identifier><identifier>DOI: 10.1134/S1063784213050253</identifier><language>eng</language><publisher>Dordrecht: SP MAIK Nauka/Interperiodica</publisher><subject>Classical and Continuum Physics ; Copper industry ; Hardness ; Metal powder products ; Metal powders ; Molybdenum compounds ; Physics ; Physics and Astronomy ; Solid State ; Titanium dioxide</subject><ispartof>Technical physics, 2013-05, Vol.58 (5), p.710-714</ispartof><rights>Pleiades Publishing, Ltd. 2013</rights><rights>COPYRIGHT 2013 Springer</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c327t-91e819a125ea318e407dd5705768156b5b5f941aeaaa781c2c333ef9df6c2b0e3</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1134/S1063784213050253$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1134/S1063784213050253$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,776,780,27901,27902,41464,42533,51294</link.rule.ids></links><search><creatorcontrib>Zeer, G. M.</creatorcontrib><creatorcontrib>Zelenkova, E. G.</creatorcontrib><creatorcontrib>Sidorak, A. V.</creatorcontrib><creatorcontrib>Ledyaeva, O. N.</creatorcontrib><creatorcontrib>Kuchinskii, M. Yu</creatorcontrib><title>Microstructure and properties of a copper electrocontact material with a nanodispersed titanium dioxide additive</title><title>Technical physics</title><addtitle>Tech. Phys</addtitle><description>The influence of TiO
2
nanopowder additive on the microstructure, physicomechanical properties, and performance characteristics of a copper-based composite is studied. The properties of the composites are compared with those of pure copper compacts. The microstructure and state of the composite’s working surface after performance tests are examined. It is shown that, when the amount of TiO
2
grows, the hardness of the material rises and the arc quenching effect is enhanced.</description><subject>Classical and Continuum Physics</subject><subject>Copper industry</subject><subject>Hardness</subject><subject>Metal powder products</subject><subject>Metal powders</subject><subject>Molybdenum compounds</subject><subject>Physics</subject><subject>Physics and Astronomy</subject><subject>Solid State</subject><subject>Titanium dioxide</subject><issn>1063-7842</issn><issn>1090-6525</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><recordid>eNp9UMtKAzEUDaJgrX6Au_zA1NykmceyFF9QcaGuh9vkTk1pJ0OS8fH3ptSdIHdxX-ccOIexaxAzADW_eQFRqqqeS1BCC6nVCZuAaERRaqlPD3OpisP_nF3EuBUCoNblhA1PzgQfUxhNGgNx7C0fgh8oJEeR-44jN37IO6cdmRS88X1Ck_geEwWHO_7p0ntG9dh762JGRrI8uYS9G_fcOv_lbBa21iX3QZfsrMNdpKvfPmVvd7evy4di9Xz_uFysCqNklYoGqIYGQWpCBTXNRWWtroSuyhp0udZr3TVzQELEqgYjjVKKusZ2pZFrQWrKZkfdDe6odX3nU0CTy9LeZQ_UuXxfKFWJCmROZ8rgSDjkEQN17RDcHsN3C6I9ZNz-yThz5JETM7bfUGi3fgx99vUP6QeD94BH</recordid><startdate>20130501</startdate><enddate>20130501</enddate><creator>Zeer, G. M.</creator><creator>Zelenkova, E. G.</creator><creator>Sidorak, A. V.</creator><creator>Ledyaeva, O. N.</creator><creator>Kuchinskii, M. Yu</creator><general>SP MAIK Nauka/Interperiodica</general><general>Springer</general><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>20130501</creationdate><title>Microstructure and properties of a copper electrocontact material with a nanodispersed titanium dioxide additive</title><author>Zeer, G. M. ; Zelenkova, E. G. ; Sidorak, A. V. ; Ledyaeva, O. N. ; Kuchinskii, M. Yu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c327t-91e819a125ea318e407dd5705768156b5b5f941aeaaa781c2c333ef9df6c2b0e3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Classical and Continuum Physics</topic><topic>Copper industry</topic><topic>Hardness</topic><topic>Metal powder products</topic><topic>Metal powders</topic><topic>Molybdenum compounds</topic><topic>Physics</topic><topic>Physics and Astronomy</topic><topic>Solid State</topic><topic>Titanium dioxide</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Zeer, G. M.</creatorcontrib><creatorcontrib>Zelenkova, E. G.</creatorcontrib><creatorcontrib>Sidorak, A. V.</creatorcontrib><creatorcontrib>Ledyaeva, O. N.</creatorcontrib><creatorcontrib>Kuchinskii, M. Yu</creatorcontrib><collection>CrossRef</collection><jtitle>Technical physics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Zeer, G. M.</au><au>Zelenkova, E. G.</au><au>Sidorak, A. V.</au><au>Ledyaeva, O. N.</au><au>Kuchinskii, M. Yu</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Microstructure and properties of a copper electrocontact material with a nanodispersed titanium dioxide additive</atitle><jtitle>Technical physics</jtitle><stitle>Tech. Phys</stitle><date>2013-05-01</date><risdate>2013</risdate><volume>58</volume><issue>5</issue><spage>710</spage><epage>714</epage><pages>710-714</pages><issn>1063-7842</issn><eissn>1090-6525</eissn><abstract>The influence of TiO
2
nanopowder additive on the microstructure, physicomechanical properties, and performance characteristics of a copper-based composite is studied. The properties of the composites are compared with those of pure copper compacts. The microstructure and state of the composite’s working surface after performance tests are examined. It is shown that, when the amount of TiO
2
grows, the hardness of the material rises and the arc quenching effect is enhanced.</abstract><cop>Dordrecht</cop><pub>SP MAIK Nauka/Interperiodica</pub><doi>10.1134/S1063784213050253</doi><tpages>5</tpages></addata></record> |
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source | Springer Journals |
subjects | Classical and Continuum Physics Copper industry Hardness Metal powder products Metal powders Molybdenum compounds Physics Physics and Astronomy Solid State Titanium dioxide |
title | Microstructure and properties of a copper electrocontact material with a nanodispersed titanium dioxide additive |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-11T19%3A13%3A47IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-gale_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Microstructure%20and%20properties%20of%20a%20copper%20electrocontact%20material%20with%20a%20nanodispersed%20titanium%20dioxide%20additive&rft.jtitle=Technical%20physics&rft.au=Zeer,%20G.%20M.&rft.date=2013-05-01&rft.volume=58&rft.issue=5&rft.spage=710&rft.epage=714&rft.pages=710-714&rft.issn=1063-7842&rft.eissn=1090-6525&rft_id=info:doi/10.1134/S1063784213050253&rft_dat=%3Cgale_cross%3EA337071206%3C/gale_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_galeid=A337071206&rfr_iscdi=true |