Microstructure and properties of a copper electrocontact material with a nanodispersed titanium dioxide additive

The influence of TiO 2 nanopowder additive on the microstructure, physicomechanical properties, and performance characteristics of a copper-based composite is studied. The properties of the composites are compared with those of pure copper compacts. The microstructure and state of the composite’s wo...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Technical physics 2013-05, Vol.58 (5), p.710-714
Hauptverfasser: Zeer, G. M., Zelenkova, E. G., Sidorak, A. V., Ledyaeva, O. N., Kuchinskii, M. Yu
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The influence of TiO 2 nanopowder additive on the microstructure, physicomechanical properties, and performance characteristics of a copper-based composite is studied. The properties of the composites are compared with those of pure copper compacts. The microstructure and state of the composite’s working surface after performance tests are examined. It is shown that, when the amount of TiO 2 grows, the hardness of the material rises and the arc quenching effect is enhanced.
ISSN:1063-7842
1090-6525
DOI:10.1134/S1063784213050253