Verfahren zum Ausbilden einer elektrisch leitfähigen Struktur auf einem Kunststoffsubstrat

WO15082179A1 [EN] The invention relates to a method for forming an electrically conductive structure on a plastic substrate, wherein an ink, which contains electrically conductive solid particles, is printed on the plastic substrate, wherein copper particles are used as electrically conductive solid...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Fahland, Matthias, Graffel, Benjamin, Mattausch, Gösta, Winckler, Falk, Weiss, Stefan, Mosch, Sindy, Jurk, Robert
Format: Patent
Sprache:ger
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Zusammenfassung:WO15082179A1 [EN] The invention relates to a method for forming an electrically conductive structure on a plastic substrate, wherein an ink, which contains electrically conductive solid particles, is printed on the plastic substrate, wherein copper particles are used as electrically conductive solid particles and, after the printing of the ink, only the surface regions of the plastic substrate on which the electrically conductive structure is to be formed are swept over by means of an electron beam having a first energy per unit length within a vacuum chamber, which first energy per unit length causes sintering of the copper particles.