Verfahren zur Herstellung einer metallischen Kontaktstruktur einer photovoltaischen Solarzelle

The method involves forming a metal particle portion containing paste, at several local areas of a semiconductor substrate (1), and forming an auxiliary metal particle portion containing paste in a state covering the metal particle portion. The semiconductor substrate is heated. The glass frit pastes (3a,3b) are applied to an insulating layer (2) on substrate to form electrical conductive contact with substrate where silver pastes (4a,4b) provided over the glass frit pastes are not applied to the insulating layer and electrically contacted with substrate indirectly.