Arrangement of a casing for accommodating an inert-gas atmosphere for soldering printed circuit boards

The invention relates to an arrangement of a shroud (10, 23, 24) for accommodating a protective gas atmosphere for soldering printed circuit modules on a solder container (21). Said printed circuit modules are brought into contact with at least one solder wave in the container whilst they are being transported through the shroud. The shroud has an inlet for the printed circuit modules on an inlet side and an outlet for the same on an outlet side. The inventive arrangement also has a supply of non-oxidising gas and a device for admitting gas into the shroud. Connecting means (12, 17, 18) are provided at the upper end of the solder container to allow for the contact-free arrangement of the shroud (10, 23, 24) with the solder bath (34). The inventive shroud is therefore easy to assemble and disassemble for use with existing wave soldering installations.