Seamless, heat shrinkable casing with narrow lay-flat width

A polymeric, heat shrinkable, seamless casing suitable for cook-in applications has at least one polymeric layer, and a lay-flat width of less than 6 1/2 inches, and thus has a narrower lay-flat width than conventional heat shrinkable, polymeric seamless casings adapted for cook-in applications. A n...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: MARTINDALE NELSON
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A polymeric, heat shrinkable, seamless casing suitable for cook-in applications has at least one polymeric layer, and a lay-flat width of less than 6 1/2 inches, and thus has a narrower lay-flat width than conventional heat shrinkable, polymeric seamless casings adapted for cook-in applications. A narrow width casing of this type fills a long-felt market need. The invention is also a package having a food article, and a polymeric, heat shrinkable, seamless casing which encloses the food article, the casing having at least one polymeric layer, and the casing having a lay flat width of less than 6 1/2 inches.