Seamless, heat shrinkable casing with narrow lay-flat width
A polymeric, heat shrinkable, seamless casing suitable for cook-in applications has at least one polymeric layer, and a lay-flat width of less than 6 1/2 inches, and thus has a narrower lay-flat width than conventional heat shrinkable, polymeric seamless casings adapted for cook-in applications. A n...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A polymeric, heat shrinkable, seamless casing suitable for cook-in applications has at least one polymeric layer, and a lay-flat width of less than 6 1/2 inches, and thus has a narrower lay-flat width than conventional heat shrinkable, polymeric seamless casings adapted for cook-in applications. A narrow width casing of this type fills a long-felt market need. The invention is also a package having a food article, and a polymeric, heat shrinkable, seamless casing which encloses the food article, the casing having at least one polymeric layer, and the casing having a lay flat width of less than 6 1/2 inches. |
---|