Heat sink mounting system for semiconductor devices
A method of mounting a semiconductor device (4) to a heat sink (8) where an opening (12) in the circuit board (6) is formed and sized to allow the semiconductor device (4) to pass therethrough, where a heat sink (8) is positioned on one side of the circuit board (6) and a load is introduced on a sec...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | ARDEN MARCUS MCCONNELL MARK LORING LANTING FREDERICK GERALD GOESCHEL |
| description | A method of mounting a semiconductor device (4) to a heat sink (8) where an opening (12) in the circuit board (6) is formed and sized to allow the semiconductor device (4) to pass therethrough, where a heat sink (8) is positioned on one side of the circuit board (6) and a load is introduced on a second side of the circuit board (6) and applied to the semiconductor device (4) forcing it against the heat sink (8). |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_ZA933873B</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>ZA933873B</sourcerecordid><originalsourceid>FETCH-epo_espacenet_ZA933873B3</originalsourceid><addsrcrecordid>eNrjZDD2SE0sUSjOzMtWyM0vzSvJzEtXKK4sLknNVUjLL1IoTs3NTM7PSylNLgHyUlLLMpNTi3kYWNMSc4pTeaE0N4Ocm2uIs4duakF-fGpxQWJyal5qSXyUo6WxsYW5sZMxQQUAJswrwg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Heat sink mounting system for semiconductor devices</title><source>esp@cenet</source><creator>ARDEN MARCUS MCCONNELL ; MARK LORING LANTING ; FREDERICK GERALD GOESCHEL</creator><creatorcontrib>ARDEN MARCUS MCCONNELL ; MARK LORING LANTING ; FREDERICK GERALD GOESCHEL</creatorcontrib><description>A method of mounting a semiconductor device (4) to a heat sink (8) where an opening (12) in the circuit board (6) is formed and sized to allow the semiconductor device (4) to pass therethrough, where a heat sink (8) is positioned on one side of the circuit board (6) and a load is introduced on a second side of the circuit board (6) and applied to the semiconductor device (4) forcing it against the heat sink (8).</description><edition>5</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1993</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19931227&DB=EPODOC&CC=ZA&NR=933873B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19931227&DB=EPODOC&CC=ZA&NR=933873B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ARDEN MARCUS MCCONNELL</creatorcontrib><creatorcontrib>MARK LORING LANTING</creatorcontrib><creatorcontrib>FREDERICK GERALD GOESCHEL</creatorcontrib><title>Heat sink mounting system for semiconductor devices</title><description>A method of mounting a semiconductor device (4) to a heat sink (8) where an opening (12) in the circuit board (6) is formed and sized to allow the semiconductor device (4) to pass therethrough, where a heat sink (8) is positioned on one side of the circuit board (6) and a load is introduced on a second side of the circuit board (6) and applied to the semiconductor device (4) forcing it against the heat sink (8).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1993</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD2SE0sUSjOzMtWyM0vzSvJzEtXKK4sLknNVUjLL1IoTs3NTM7PSylNLgHyUlLLMpNTi3kYWNMSc4pTeaE0N4Ocm2uIs4duakF-fGpxQWJyal5qSXyUo6WxsYW5sZMxQQUAJswrwg</recordid><startdate>19931227</startdate><enddate>19931227</enddate><creator>ARDEN MARCUS MCCONNELL</creator><creator>MARK LORING LANTING</creator><creator>FREDERICK GERALD GOESCHEL</creator><scope>EVB</scope></search><sort><creationdate>19931227</creationdate><title>Heat sink mounting system for semiconductor devices</title><author>ARDEN MARCUS MCCONNELL ; MARK LORING LANTING ; FREDERICK GERALD GOESCHEL</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_ZA933873B3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1993</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>ARDEN MARCUS MCCONNELL</creatorcontrib><creatorcontrib>MARK LORING LANTING</creatorcontrib><creatorcontrib>FREDERICK GERALD GOESCHEL</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ARDEN MARCUS MCCONNELL</au><au>MARK LORING LANTING</au><au>FREDERICK GERALD GOESCHEL</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Heat sink mounting system for semiconductor devices</title><date>1993-12-27</date><risdate>1993</risdate><abstract>A method of mounting a semiconductor device (4) to a heat sink (8) where an opening (12) in the circuit board (6) is formed and sized to allow the semiconductor device (4) to pass therethrough, where a heat sink (8) is positioned on one side of the circuit board (6) and a load is introduced on a second side of the circuit board (6) and applied to the semiconductor device (4) forcing it against the heat sink (8).</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_ZA933873B |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Heat sink mounting system for semiconductor devices |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-13T05%3A38%3A39IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ARDEN%20MARCUS%20MCCONNELL&rft.date=1993-12-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EZA933873B%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |