Heat sink mounting system for semiconductor devices

A method of mounting a semiconductor device (4) to a heat sink (8) where an opening (12) in the circuit board (6) is formed and sized to allow the semiconductor device (4) to pass therethrough, where a heat sink (8) is positioned on one side of the circuit board (6) and a load is introduced on a sec...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ARDEN MARCUS MCCONNELL, MARK LORING LANTING, FREDERICK GERALD GOESCHEL
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A method of mounting a semiconductor device (4) to a heat sink (8) where an opening (12) in the circuit board (6) is formed and sized to allow the semiconductor device (4) to pass therethrough, where a heat sink (8) is positioned on one side of the circuit board (6) and a load is introduced on a second side of the circuit board (6) and applied to the semiconductor device (4) forcing it against the heat sink (8).