Apparatus for depositing on a substrate by chemical vapour deposition

Apparatus for the deposition of a material such as diamond on a substrate (28) by chemical vapour deposition is provided. The apparatus comprises: support shelf (18) on which the substrate (28) is located; a resistance heating element in the form of an elongate strip (38) of conductive material havi...

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Bibliographische Detailangaben
1. Verfasser:	RICARDO SIMON SUSSMANN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Apparatus for the deposition of a material such as diamond on a substrate (28) by chemical vapour deposition is provided. The apparatus comprises: support shelf (18) on which the substrate (28) is located; a resistance heating element in the form of an elongate strip (38) of conductive material having at least one curved section (48, 50) in its length; the elongate strip (38) being positioned relative to, and spaced from, the substrate (28) such that it presents an elongate edge (54) to the substrate (28) and an elongate edge (56) away from the substrate (28); and means such as a perforated pipe (12) for causing reaction gas for the deposition to pass across the elongate strip (38) from one longitudinal edge (56) to the other (54) and then to the support shelf (18) and the substrate (28) located thereon.