BACK-END LASER INTEGRATION DEVICE FOR HIGH-END LASER DICING MACHINE OF MINILED CHIP

The present invention discloses a back-end laser integration device for a high-end laser dicing machine of a MiniLED chip and relates to the field of the MiniLED chip integration technologies. The back-end laser integration device for a high-end laser dicing machine of a MiniLED chip includes a laser integration machine. An inner side of the laser integration machine is provided with a conveyor belt, a surface of the conveyor belt is provided with an integration apparatus, the integration apparatus includes an integration plate, a lower side of the integration plate is disposed on an upper side of the conveyor belt, and the lower side of the integration plate is slidably connected to a bottom plate. The back-end laser integration device for a high-end laser dicing machine of a MiniLED chip ensures that the integration plate can achieve an orderly effect when integrating dices with different radiuses, guaranteeing the use flexibility of the integration plate. This makes it simple for the integration plate to adjust the dices with different radiuses, and significantly reduces the complexity of necessarily replacing different integration boxes when dices with different radiuses are integrated in the conventional technologies, reducing material waste when integration boxes in different models are spared, thus greatly ensuring the use efficiency of the integration plate to integrate dices with different radiuses.