HEAT RESISTANT ADHESIVE, PREPARATION METHOD THEREFOR, AND BONDING METHOD FOR ALUMINUM ALLOY

The present application relates to the field of adhesives, and specifically relates to a heat resistant adhesive, a preparation method therefor, and a bonding method for an aluminum alloy. A new-type heat resistant adhesive is prepared by combining a polysulfone resin with a biphenol compound. The heat resistant adhesive prepared by the preparation method of the present application and the aluminum alloy bonded by the bonding method have a higher bonding strength at room temperature and at 150ºC, and still have a good bonding strength after aging at 150ºC for 200 h. Furthermore, the adhesive obtained by the preparation method has a larger space for modification and adjustment, and can be cooperated with a variety of modifiers to obtain adhesives with different properties, so as to adapt to various application scenarios. In the preparation method for the heat resistant adhesive and the bonding method for an aluminum alloy of the present application, an adhesive and an aluminum alloy bonding material, which have a lower production cost, a simpler process, and a higher bonding strength, can be obtained.