Mixtures of at least one filler and organosilicon compounds, process for their preparation and their use

Mixtures of at least one filler and organosilicon compounds, process for their preparation and their use

Sulfur-containing organosilicon compounds contain surface-treated hydrophobic precipitated silica as a filler. Blends of sulfur-containing organosilicon compounds of formula YSxZ (I) with a filler are such that the filler is surface-treated hydrophobic precipitated silica. Y = R R R Si-R ; R - R = 1...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: HANS-DETLEF LUGINSLAND
Format: Patent
Sprache:eng
Schlagworte:
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS
MAKING GRANULES OR PREFORMS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
PERFORMING OPERATIONS
POLISHES
PREPARATION OF CARBON BLACK
PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED
RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:Sulfur-containing organosilicon compounds contain surface-treated hydrophobic precipitated silica as a filler. Blends of sulfur-containing organosilicon compounds of formula YSxZ (I) with a filler are such that the filler is surface-treated hydrophobic precipitated silica. Y = R R R Si-R ; R - R = 1-4C alkyl or alkoxy; R = 0-6C alkylidene; x = 1-10; and Z = H, CN or Y An Independent claim is included for the preparation of the blend by homogeneously 'dusting' (I) onto the silica in a mixer at below 50 degrees C.