SEGMENTED POLISHING PAD

A segmented polishing pad for use in the chemical-mechanical polishing of workpieces is presented which preferably comprises a plurality of pie-shaped segments (159). The plurality of individual pie-shaped segments (158) may also have channels (164) located between them. The segmented polishing pad...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KARLSRUD, CHRIS
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!