PROCESS AND DEVICE FOR APPLYING A PHOTORESIST LACQUER ON UNEVEN BASE BODY SURFACES
Bei einer Vorrichtung zum Auftragen von Fotoresistlack auf nicht ebene Oberflächen eines beliebig geformten Grundkörpers, insbesondere Rotationskörpers, sind eine Aufnahmeeinrichtung (14) für den Grundkörper (40), eine relativ dazu bewegbare Zuführungseinrichtung (20) für den Fotoresistlack (50) und...
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creator | DAAUD, SIMONE BOETTCHER, REINULF LUETHJE, HOLGER |
description | Bei einer Vorrichtung zum Auftragen von Fotoresistlack auf nicht ebene Oberflächen eines beliebig geformten Grundkörpers, insbesondere Rotationskörpers, sind eine Aufnahmeeinrichtung (14) für den Grundkörper (40), eine relativ dazu bewegbare Zuführungseinrichtung (20) für den Fotoresistlack (50) und Mittel (16) zum definierten Bewegen des Grundkörpers vorgesehen, wobei die Zuführungseinrichtung (20) zumindest ein Punktquellmittel (30) zum Legen einer Spur (51) auf der Oberfläche (41) des Grundkörpers (40) aufweist.
A device for applying photoresist lacquer on uneven surfaces of base bodies of any shape, in particular rotation bodies, has a receptacle (14) for the base body (40), a supply unit (20) movable in relation thereto for supplying the photoresist lacquer (50) and means (16) for moving the base body in a defined manner. The supply unit (20) has at least one point source (30) for applying a trace (51) on the surface (41) of the base body (40).
L'invention concerne un dispositif pour l'application de photorésist sur des surfaces non planes d'un substrat de forme quelconque, notamment un corps rotatif. Ce dispositif comporte un système de support (14) pour le substrat (40), un système d'apport (20) du photorésist (50), mobile par rapport au substrat (40), et des moyens (16) permettant le mouvement défini du substrat. Le système d'apport (20) présente au moins une source ponctuelle (30) pour déposer un ruban (51) sur la surface (41) du substrat (40). |
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A device for applying photoresist lacquer on uneven surfaces of base bodies of any shape, in particular rotation bodies, has a receptacle (14) for the base body (40), a supply unit (20) movable in relation thereto for supplying the photoresist lacquer (50) and means (16) for moving the base body in a defined manner. The supply unit (20) has at least one point source (30) for applying a trace (51) on the surface (41) of the base body (40).
L'invention concerne un dispositif pour l'application de photorésist sur des surfaces non planes d'un substrat de forme quelconque, notamment un corps rotatif. Ce dispositif comporte un système de support (14) pour le substrat (40), un système d'apport (20) du photorésist (50), mobile par rapport au substrat (40), et des moyens (16) permettant le mouvement défini du substrat. Le système d'apport (20) présente au moins une source ponctuelle (30) pour déposer un ruban (51) sur la surface (41) du substrat (40).</description><edition>6</edition><language>eng ; fre ; ger</language><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; APPARATUS SPECIALLY ADAPTED THEREFOR ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; ATOMISING APPARATUS ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; MICROSTRUCTURAL TECHNOLOGY ; NOZZLES ; ORIGINALS THEREFOR ; PERFORMING OPERATIONS ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; SEMICONDUCTOR DEVICES ; SPRAYING APPARATUS ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>1998</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980226&DB=EPODOC&CC=WO&NR=9808144A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980226&DB=EPODOC&CC=WO&NR=9808144A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DAAUD, SIMONE</creatorcontrib><creatorcontrib>BOETTCHER, REINULF</creatorcontrib><creatorcontrib>LUETHJE, HOLGER</creatorcontrib><title>PROCESS AND DEVICE FOR APPLYING A PHOTORESIST LACQUER ON UNEVEN BASE BODY SURFACES</title><description>Bei einer Vorrichtung zum Auftragen von Fotoresistlack auf nicht ebene Oberflächen eines beliebig geformten Grundkörpers, insbesondere Rotationskörpers, sind eine Aufnahmeeinrichtung (14) für den Grundkörper (40), eine relativ dazu bewegbare Zuführungseinrichtung (20) für den Fotoresistlack (50) und Mittel (16) zum definierten Bewegen des Grundkörpers vorgesehen, wobei die Zuführungseinrichtung (20) zumindest ein Punktquellmittel (30) zum Legen einer Spur (51) auf der Oberfläche (41) des Grundkörpers (40) aufweist.
A device for applying photoresist lacquer on uneven surfaces of base bodies of any shape, in particular rotation bodies, has a receptacle (14) for the base body (40), a supply unit (20) movable in relation thereto for supplying the photoresist lacquer (50) and means (16) for moving the base body in a defined manner. The supply unit (20) has at least one point source (30) for applying a trace (51) on the surface (41) of the base body (40).
L'invention concerne un dispositif pour l'application de photorésist sur des surfaces non planes d'un substrat de forme quelconque, notamment un corps rotatif. Ce dispositif comporte un système de support (14) pour le substrat (40), un système d'apport (20) du photorésist (50), mobile par rapport au substrat (40), et des moyens (16) permettant le mouvement défini du substrat. Le système d'apport (20) présente au moins une source ponctuelle (30) pour déposer un ruban (51) sur la surface (41) du substrat (40).</description><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>ATOMISING APPARATUS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>NOZZLES</subject><subject>ORIGINALS THEREFOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SPRAYING APPARATUS</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1998</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzLEKwjAURuEuDqK-w_8CgsUOdbxNbmyg5MakrXQqReIkWqjvjw4-gNNZPs46Cz6I4hhBTkNzbxXDSAB53wzWnUHwtbQSONrYoiF16ThAHDrHPTtUFBmV6AGxC4a-r222uk-PJe1-3WQw3Kp6n-bXmJZ5uqVneo9XOZWHMi8Kyo9_kA9kjC85</recordid><startdate>19980226</startdate><enddate>19980226</enddate><creator>DAAUD, SIMONE</creator><creator>BOETTCHER, REINULF</creator><creator>LUETHJE, HOLGER</creator><scope>EVB</scope></search><sort><creationdate>19980226</creationdate><title>PROCESS AND DEVICE FOR APPLYING A PHOTORESIST LACQUER ON UNEVEN BASE BODY SURFACES</title><author>DAAUD, SIMONE ; BOETTCHER, REINULF ; LUETHJE, HOLGER</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO9808144A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>1998</creationdate><topic>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>ATOMISING APPARATUS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>NOZZLES</topic><topic>ORIGINALS THEREFOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SPRAYING APPARATUS</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>DAAUD, SIMONE</creatorcontrib><creatorcontrib>BOETTCHER, REINULF</creatorcontrib><creatorcontrib>LUETHJE, HOLGER</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DAAUD, SIMONE</au><au>BOETTCHER, REINULF</au><au>LUETHJE, HOLGER</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PROCESS AND DEVICE FOR APPLYING A PHOTORESIST LACQUER ON UNEVEN BASE BODY SURFACES</title><date>1998-02-26</date><risdate>1998</risdate><abstract>Bei einer Vorrichtung zum Auftragen von Fotoresistlack auf nicht ebene Oberflächen eines beliebig geformten Grundkörpers, insbesondere Rotationskörpers, sind eine Aufnahmeeinrichtung (14) für den Grundkörper (40), eine relativ dazu bewegbare Zuführungseinrichtung (20) für den Fotoresistlack (50) und Mittel (16) zum definierten Bewegen des Grundkörpers vorgesehen, wobei die Zuführungseinrichtung (20) zumindest ein Punktquellmittel (30) zum Legen einer Spur (51) auf der Oberfläche (41) des Grundkörpers (40) aufweist.
A device for applying photoresist lacquer on uneven surfaces of base bodies of any shape, in particular rotation bodies, has a receptacle (14) for the base body (40), a supply unit (20) movable in relation thereto for supplying the photoresist lacquer (50) and means (16) for moving the base body in a defined manner. The supply unit (20) has at least one point source (30) for applying a trace (51) on the surface (41) of the base body (40).
L'invention concerne un dispositif pour l'application de photorésist sur des surfaces non planes d'un substrat de forme quelconque, notamment un corps rotatif. Ce dispositif comporte un système de support (14) pour le substrat (40), un système d'apport (20) du photorésist (50), mobile par rapport au substrat (40), et des moyens (16) permettant le mouvement défini du substrat. Le système d'apport (20) présente au moins une source ponctuelle (30) pour déposer un ruban (51) sur la surface (41) du substrat (40).</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR MICROSTRUCTURAL TECHNOLOGY NOZZLES ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
title | PROCESS AND DEVICE FOR APPLYING A PHOTORESIST LACQUER ON UNEVEN BASE BODY SURFACES |
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