COMPOSITE SUBSTRATES FOR PREPARATION OF PRINTED CIRCUITS

Substrates for printed circuit boards and the like, in the form of a substrate base layer and at least one adherent layer fixedly attached thereto. The adherent layer preferably comprises a thermoplastic material having a glass transition temperature in the range of about 180 DEG and about 245 DEG C...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TODD, MICHAEL, GEORGE, CAPOTE, MIGUEL, ALBERT
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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