EDGE CONNECTABLE METAL PACKAGE

There is provided an edge connectable electronic package (90). The package (90) has a metallic base (92) at least partially coated with a dielectric layer. An interconnection means (96) taking the form of either a leadframe or a circuit trace is electrically interconnected to an encased semiconducto...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BRADEN, JEFFREY, S, HOFFMAN, PAUL, R, POPPLEWELL, JAMES, M
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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