SEALED ELECTRONIC PACKAGE PROVIDING IN-SITU METALLIZATION

In-situ adjustments to frequency characteristics of an electronic device such as a piezoelectric element (40) can be accomplished by names of a predetermined atmosphere (18) enclosed within a package comprised of a base (12) and a cover (14) and an included amount of sputterable electrode material (...

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Hauptverfasser: MANCINI, BRIAN, M, KNECHT, THOMAS, A, KRAUSE, JOSEPH, P
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creator MANCINI, BRIAN, M
KNECHT, THOMAS, A
KRAUSE, JOSEPH, P
description In-situ adjustments to frequency characteristics of an electronic device such as a piezoelectric element (40) can be accomplished by names of a predetermined atmosphere (18) enclosed within a package comprised of a base (12) and a cover (14) and an included amount of sputterable electrode material (22). By attachment of appropriate electric potentials (2), electrode molecules can be sputtered onto the electrode surfaces adjusting the resonant frequency characteristics of a crystal filter. Un dispositif électronique tel qu'un élément piézoélectrique (40) peut être ajusté in situ à des caractéristiques de fréquence données à l'aide d'une atmosphère prédéterminée (18) enfermée dans un emballage composé d'une base (12) et d'un couvercle, (14) et d'une quantité incluse de matériau d'électrode pour métallisation au vide (22) L'application de potentiels électriques appropriés (2) permet de puvériser des mollécules d'électrode sur des surfaces d'électrode et d'ajuster ainsi les caractéristiques de fréquence de résonance d'un filtre à quartz.
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subjects BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION OF NOISE BY SUCH CIRCUITS
GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING,BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN ANON-SWITCHING MANNER
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
RESONATORS
SEMICONDUCTOR DEVICES
title SEALED ELECTRONIC PACKAGE PROVIDING IN-SITU METALLIZATION
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