ORGANIC PRECLEAN FOR IMPROVING VAPOR PHASE WAFER ETCH UNIFORMITY

A method for achieving greater uniformity and control in vapor phase etching of silicon, silicon oxide layers and related materials associated with wafers used for semiconductor devices comprises the steps of first cleaning the wafer (3) surface to remove organics, followed by vapor phase etching. A...

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Bibliographische Detailangaben

Hauptverfasser:	KAO, DAH-BIN, DELARIOS, JOHN, M, MANRIQUEZ, RALPH, K, MCNEILLY, MICHAEL, A, NOBINGER, GLENN, L, KRUSELL, WILBUR, C
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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