PHENOLIC RESIN-POLYISOCYANATE BINDER SYSTEMS

A binder composition containing a phenilic resin in an organic solvent, a polyisocyanate, wherein said organic solvent is substantially free from polar solvents, methods of making foundry shapes using said composition and methods of casting metals in such shapes. Une composition de liaison contient...

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Bibliographische Detailangaben
1. Verfasser:	GARDIKES, JOHN, J
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASTING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES FOUNDRY MOULDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES POWDER METALLURGY SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG, OR MIXTURESCONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES WORKING CEMENT, CLAY, OR STONE
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Beschreibung
Zusammenfassung:	A binder composition containing a phenilic resin in an organic solvent, a polyisocyanate, wherein said organic solvent is substantially free from polar solvents, methods of making foundry shapes using said composition and methods of casting metals in such shapes. Une composition de liaison contient une résine phénolique dans un solvant organique, un polyisocyanate, ledit solvant organique étant sensiblement libre de solvants polaires; procédés de fabrication de formes de fonderie avec ladite composition et procédés de coulée de métaux dans ces formes.