EPOXY MOLDING COMPOUND
The compound includes: a) from about 5 to 90 % by weight of curable epoxy resin; b) from about 0.01 to 10 % by weight of an aromatic onium salt of the formula: wherein each R is a monovalent organic aromatic radical; X is selected from the group consisting of sulfur and iodine; C is a Lewis acid pol...
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| creator | ALLEN RICHARD BRIAN |
| description | The compound includes: a) from about 5 to 90 % by weight of curable epoxy resin; b) from about 0.01 to 10 % by weight of an aromatic onium salt of the formula: wherein each R is a monovalent organic aromatic radical; X is selected from the group consisting of sulfur and iodine; C is a Lewis acid polymerization catalyst precursor; a equals the absolute value of the valence number of (X minus 1); and b equals the absolute value of the valence number of C; c) from about 0.01 to 10 % by weight of peroxide compound effective to activate said catalyst; and d) from about 10 to 95 % by weight of filler, based on the total weight of the composition. These molding compounds exhibit both superior curing rates and storage stability.
Compose de moulage ameliore. Ce compose comprend: a) de 5 a 90% environ en poids de resine epoxyde polymerisable; b) de 0, 01 a 10% en poids d'un sel d'onium aromatique correspondant a la formule: (FORMULE) dans laquelle chaque R est un radical aromatique organique monovalent; X est selectionne dans le groupe se composant de soufre et d'iode; C est un precurseur de catalyseur de polymerisation d'acide de Lewis; a est egal a la valeur absolue du nombre de valences de (X moins 1); et b est egal a la valeur absolue du nombre de valences de C; c) de 0,01 a 10% en poids d'un compose de peroxyde efficace pour l'activation dudit catalyseur; et d) de 10 a 90% en poids d'un agent de remplissage, en fonction du poids total de la composition. Ces composes de moulage presentent des vitesses superieures de polymerisation et une meilleure stabilite au stockage. |
| format | Patent |
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Compose de moulage ameliore. Ce compose comprend: a) de 5 a 90% environ en poids de resine epoxyde polymerisable; b) de 0, 01 a 10% en poids d'un sel d'onium aromatique correspondant a la formule: (FORMULE) dans laquelle chaque R est un radical aromatique organique monovalent; X est selectionne dans le groupe se composant de soufre et d'iode; C est un precurseur de catalyseur de polymerisation d'acide de Lewis; a est egal a la valeur absolue du nombre de valences de (X moins 1); et b est egal a la valeur absolue du nombre de valences de C; c) de 0,01 a 10% en poids d'un compose de peroxyde efficace pour l'activation dudit catalyseur; et d) de 10 a 90% en poids d'un agent de remplissage, en fonction du poids total de la composition. Ces composes de moulage presentent des vitesses superieures de polymerisation et une meilleure stabilite au stockage.</description><language>eng</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>1982</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19821209&DB=EPODOC&CC=WO&NR=8204258A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19821209&DB=EPODOC&CC=WO&NR=8204258A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ALLEN RICHARD BRIAN</creatorcontrib><title>EPOXY MOLDING COMPOUND</title><description>The compound includes: a) from about 5 to 90 % by weight of curable epoxy resin; b) from about 0.01 to 10 % by weight of an aromatic onium salt of the formula: wherein each R is a monovalent organic aromatic radical; X is selected from the group consisting of sulfur and iodine; C is a Lewis acid polymerization catalyst precursor; a equals the absolute value of the valence number of (X minus 1); and b equals the absolute value of the valence number of C; c) from about 0.01 to 10 % by weight of peroxide compound effective to activate said catalyst; and d) from about 10 to 95 % by weight of filler, based on the total weight of the composition. These molding compounds exhibit both superior curing rates and storage stability.
Compose de moulage ameliore. Ce compose comprend: a) de 5 a 90% environ en poids de resine epoxyde polymerisable; b) de 0, 01 a 10% en poids d'un sel d'onium aromatique correspondant a la formule: (FORMULE) dans laquelle chaque R est un radical aromatique organique monovalent; X est selectionne dans le groupe se composant de soufre et d'iode; C est un precurseur de catalyseur de polymerisation d'acide de Lewis; a est egal a la valeur absolue du nombre de valences de (X moins 1); et b est egal a la valeur absolue du nombre de valences de C; c) de 0,01 a 10% en poids d'un compose de peroxyde efficace pour l'activation dudit catalyseur; et d) de 10 a 90% en poids d'un agent de remplissage, en fonction du poids total de la composition. Ces composes de moulage presentent des vitesses superieures de polymerisation et une meilleure stabilite au stockage.</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1982</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBBzDfCPiFTw9fdx8fRzV3D29w3wD_Vz4WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8eH-FkYGJkamFo6GxkQoAQCKaR8F</recordid><startdate>19821209</startdate><enddate>19821209</enddate><creator>ALLEN RICHARD BRIAN</creator><scope>EVB</scope></search><sort><creationdate>19821209</creationdate><title>EPOXY MOLDING COMPOUND</title><author>ALLEN RICHARD BRIAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO8204258A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1982</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>ALLEN RICHARD BRIAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ALLEN RICHARD BRIAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EPOXY MOLDING COMPOUND</title><date>1982-12-09</date><risdate>1982</risdate><abstract>The compound includes: a) from about 5 to 90 % by weight of curable epoxy resin; b) from about 0.01 to 10 % by weight of an aromatic onium salt of the formula: wherein each R is a monovalent organic aromatic radical; X is selected from the group consisting of sulfur and iodine; C is a Lewis acid polymerization catalyst precursor; a equals the absolute value of the valence number of (X minus 1); and b equals the absolute value of the valence number of C; c) from about 0.01 to 10 % by weight of peroxide compound effective to activate said catalyst; and d) from about 10 to 95 % by weight of filler, based on the total weight of the composition. These molding compounds exhibit both superior curing rates and storage stability.
Compose de moulage ameliore. Ce compose comprend: a) de 5 a 90% environ en poids de resine epoxyde polymerisable; b) de 0, 01 a 10% en poids d'un sel d'onium aromatique correspondant a la formule: (FORMULE) dans laquelle chaque R est un radical aromatique organique monovalent; X est selectionne dans le groupe se composant de soufre et d'iode; C est un precurseur de catalyseur de polymerisation d'acide de Lewis; a est egal a la valeur absolue du nombre de valences de (X moins 1); et b est egal a la valeur absolue du nombre de valences de C; c) de 0,01 a 10% en poids d'un compose de peroxyde efficace pour l'activation dudit catalyseur; et d) de 10 a 90% en poids d'un agent de remplissage, en fonction du poids total de la composition. Ces composes de moulage presentent des vitesses superieures de polymerisation et une meilleure stabilite au stockage.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | EPOXY MOLDING COMPOUND |
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