INTERPOSER STITCH THROUGH A TOP CHIPLET

Embodiments herein describe devices that indude an interposer with a stitch formed from overlapping exposure areas, which may result in the interposer having a total surface area that is greater than a maximum reticle field corresponding to the exposure areas. Two or more Integrated circuits (e.g.,...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	VOOGEL, Martin L
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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