HOLDER FOR A SURFACE-MOUNT DEVICE, ASSEMBLY, AND CIRCUIT CARRIER

A holder (1) for an SMD (2) has a frame (10) for receiving the SMD (2), electric contacts (11) for contacting the SMD (2), and electric contacts (12) for connecting to an environment. An assembly (3) of the holder (1) and an SMD (2) contacted to the holder (1) is mounted on a circuit carrier (4). Th...

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Bibliographische Detailangaben
Hauptverfasser:	PADURARIU, Catalin, PALII, Alexandru
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS
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Beschreibung
Zusammenfassung:	A holder (1) for an SMD (2) has a frame (10) for receiving the SMD (2), electric contacts (11) for contacting the SMD (2), and electric contacts (12) for connecting to an environment. An assembly (3) of the holder (1) and an SMD (2) contacted to the holder (1) is mounted on a circuit carrier (4). The frame (10) of the holder (1) may have various angles (15) relative to a plane (40) defined by the circuit carrier (4). The assembly (3) may be in thermal contact with a heat sink (5). L'invention concerne un support (1) pour un SMD (2) qui a un cadre (10) pour recevoir le SMD (2), des contacts électriques (11) pour entrer en contact avec le SMD (2), et des contacts électriques (12) pour se connecter à un environnement. Un ensemble (3) du support (1) et un SMD (2) en contact avec le support (1) sont montés sur un support de circuit (4). Le cadre (10) du support (1) peut présenter divers angles (15) par rapport à un plan (40) défini par le support de circuit (4). L'ensemble (3) peut être en contact thermique avec un dissipateur thermique (5).