HOT MELT SEALANTS HAVING LOW THERMAL CONDUCTIVITY

The invention includes hot melt sealants having a low thermal conductivity in which the polymer component is maximized, and specialized fillers are not needed. The inventive sealants have found utility as thermoplastic spacers, edge seals and single seals. L'invention comprend des agents d'...

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Bibliographische Detailangaben
Hauptverfasser:	RAATZ, Dirk, KRON, Oliver, BECKER, Harald, WHITE, Brian, BRUECHER, Heike
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention includes hot melt sealants having a low thermal conductivity in which the polymer component is maximized, and specialized fillers are not needed. The inventive sealants have found utility as thermoplastic spacers, edge seals and single seals. L'invention comprend des agents d'étanchéité thermofusibles ayant une faible conductivité thermique dans laquelle le composant polymère est maximisé, et des charges spécialisées ne sont pas nécessaires. Les agents d'étanchéité selon l'invention se sont avérés utiles en tant qu'espaceurs thermoplastiques, joints d'étanchéité de bord et joints d'étanchéité uniques.