POLYMER AND PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAME, COPPER PASTE, LIQUID COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING COPPER PILLAR FOR SEMICONDUCTOR CONNECTION

The present invention provides a copper paste capable of reducing the number of processes for forming a copper pillar as compared with a conventional one and lowering the joining temperature.　A copper paste for manufacturing a copper pillar for semiconductor connection, comprising copper particles;...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TAKAWAKI, Kouichi, SHIMOYAMA, Akio, HAGA, Motoharu, HAPPOYA, Akihiko, NAGAI, Rumi, KOBATAKE, Takanori, TERANISHI, Tadashi, SAKAMOTO, Hirokatsu
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CASTING CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS POWDER METALLURGY SEMICONDUCTOR DEVICES TRANSPORTING WORKING METALLIC POWDER
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!