SEMICONDUCTOR STRUCTURES AND MEMORY CELLS AND METHODS FOR MANUFACTURING THE SAME

The present disclosure relates to semiconductor structures, memory devices, and methods for making the same. The semiconductor structure comprises a first substrate, a second substrate, a bonding layer, a first conductive layer, and a first dielectric layer. The second substrate is disposed on the f...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAO, Liang-Gi, WU, Nanray, LING, Peiching
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ELECTRICITY
Online-Zugang:	Volltext bestellen
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