POLYIMIDE OLIGOMER AND PREPARATION METHOD THEREFOR, AND CURED PRODUCT HAVING LOW-DIELECTRIC PROPERTIES PREPARED THEREFROM

A polyimide oligomer and a preparation method therefor, and a cured product having low-dielectric properties prepared therefrom. The polyimide oligomer has a structure as represented by formula (I) or formula (II), and the symbols in formula (I) and formula (II) are as defined in the description. Th...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HUANG, Yun-wen, LAI, Pei-cheng, KAO, Jun-qi, WANG, Meng-wei
Format:	Patent
Sprache:	chi ; eng ; fre
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A polyimide oligomer and a preparation method therefor, and a cured product having low-dielectric properties prepared therefrom. The polyimide oligomer has a structure as represented by formula (I) or formula (II), and the symbols in formula (I) and formula (II) are as defined in the description. Therefore, a dimer diamine is used to match a specific monomer and a ratio is adjusted, so as to prepare a free-radical-curable polyimide oligomer; and same has good thermal properties and excellent low-dielectric properties after being cured, so as to be used in the industry of high-frequency circuit boards. L'invention concerne un oligomère de polyimide et son procédé de préparation, ainsi qu'un produit durci ayant des propriétés faiblement diélectriques préparées à partir de celui-ci. L'oligomère de polyimide a une structure telle que représentée par la formule (I) ou la formule (II), et les symboles dans la formule (I) et la formule (II) sont tels que définis dans la description. Par conséquent, une diamine dimèr