ELECTRONIC DEVICE COMPRISING SPEAKER
An electronic device according to one embodiment of the present disclosure comprises: a housing; a speaker disposed in the housing; and a printed circuit board disposed in the housing to surround at least a portion of the speaker, wherein the speaker may comprise: a coil region in which a coil for o...
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Format: | Patent |
Sprache: | eng ; fre ; kor |
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Zusammenfassung: | An electronic device according to one embodiment of the present disclosure comprises: a housing; a speaker disposed in the housing; and a printed circuit board disposed in the housing to surround at least a portion of the speaker, wherein the speaker may comprise: a coil region in which a coil for operating the speaker is disposed inside; a flexible substrate including wiring extending to surround at least a portion of the coil region, and disposed on the periphery of the coil region; and a connection terminal formed at one end of the flexible substrate and electrically connected to the printed circuit board.
Un dispositif électronique selon un mode de réalisation de la présente invention comprend : un boîtier ; un haut-parleur disposé dans le boîtier ; et une carte de circuit imprimé disposée dans le boîtier pour entourer au moins une partie du haut-parleur, le haut-parleur pouvant comprendre : une région de bobine à l'intérieur de laquelle est disposée une bobine pour faire fonctionner le haut-parleur ; un substrat flexible comprenant un câblage s'étendant pour entourer au moins une partie de la région de bobine, et disposé sur la périphérie de la région de bobine ; et une borne de connexion formée à une extrémité du substrat flexible et connectée électriquement à la carte de circuit imprimé.
본 개시의 일 실시예에 따른 전자 장치는, 하우징, 하우징에 배치되는 스피커 및 스피커의 적어도 일부를 둘러싸도록 하우징에 배치되는 인쇄 회로 기판을 포함하며, 스피커는, 스피커의 동작을 위한 코일이 내부에 배치되는 코일 영역, 코일 영역의 적어도 일부를 둘러싸도록 연장되는 배선을 포함하며, 코일 영역의 외곽에 배치되는 연성 기판 및 연성 기판의 일단에 형성되며, 인쇄 회로 기판과 전기적으로 연결되는 연결 단자를 포함할 수 있다. |
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