VACUUM DEPOSITION SYSTEM AND METHODS OF DEPOSITING A STACK OF LAYERS ON A SUBSTRATE

A vacuum deposition system (100) for processing of essentially vertically oriented substrates is described. The vacuum deposition system (100) includes a plurality of deposition chambers (150) arranged in a row along a main transport direction (T) and housing a plurality of vacuum deposition sources (155) for depositing a stack of layers including at least one organic material on the substrates, wherein a first transportation track (T1 ) and a second transportation track (T2) extend parallel to each other in the main transport direction through the plurality of deposition chambers; a carrier transport system for transporting the substrate carriers along the first transportation track past the plurality of vacuum deposition sources (155) and along the second transportation track; a first track switch module (121 ) and a second track switch module (122) for translating the substrate carriers from the first transportation track to the second transportation track, or vice versa, in a track switch direction (S) transverse to the main transport direction (T), wherein the plurality of deposition chambers (150) are arranged between the first track switch module (121 ) and the second track switch module (122); and a substrate loading chamber (111 ) with a substrate input opening (402) for inputting substrates (10) in a non-vertical orientation, and comprising an orientation actuator for changing a substrate orientation from the non-vertical orientation to an essentially vertical orientation. Further, methods of depositing a stack of layers on a substrate in any of the vacuum deposition systems described herein are provided. L'invention concerne un système de dépôt sous vide (100) pour le traitement de substrats orientés sensiblement verticalement. Le système de dépôt sous vide (100) comprend une pluralité de chambres de dépôt (150) disposées en une rangée le long d'une direction de transport principale (T) et recevant une pluralité de sources de dépôt sous vide (155) pour déposer un empilement de couches comprenant au moins une matière organique sur les substrats, une première voie de transport (T1) et une seconde voie de transport (T2) s'étendant parallèlement l'une à l'autre dans la direction de transport principale à travers la pluralité de chambres de dépôt ; un système de transport de supports pour transporter les supports de substrat le long de la première voie de transport au-delà de la pluralité de sources de dépôt sous vide (155) et le long de la seconde v