AL-SC ALLOYS AND SPUTTERING TARGETS AND PROCESSES FOR CONSOLIDATING

A process for producing an aluminum-scandium alloy sputtering target, the process comprising: atomizing ScxAl1-x to form a powder, wherein x ranges from 0.05 and 0.5; and consolidating the powder to form a target having a microstructure characterized by an average grain size of at most 50 microns. A...

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Bibliographische Detailangaben
Hauptverfasser:	VANHEERDEN, David Peter, ZENG, Qi, GARDINIER, Katharine S, WAGNER, Jens
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY FERROUS OR NON-FERROUS ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	A process for producing an aluminum-scandium alloy sputtering target, the process comprising: atomizing ScxAl1-x to form a powder, wherein x ranges from 0.05 and 0.5; and consolidating the powder to form a target having a microstructure characterized by an average grain size of at most 50 microns. An aluminum-scandium alloy sputtering target comprising one or more Al-Sc intermetallic phases including Al-Sc intermetallic grains, wherein an average Al-Sc intermetallic grain size is at most 50 microns. L'invention concerne un procédé de production d'une cible de pulvérisation en alliage d'aluminium-scandium, le procédé comprenant : l'atomisation de ScxAl1-x pour former une poudre, x étant compris entre 0,05 et 0,5 ; et la consolidation de la poudre pour former une cible ayant une microstructure caractérisée par une taille de grain moyenne d'au plus 50 microns. L'invention concerne une cible de pulvérisation en alliage d'aluminium-scandium comprenant une ou plusieurs phases intermétalliques d'Al-Sc comprenant des grains intermétalliques d'Al-Sc, une taille de grain intermétallique moyenne d'Al-Sc étant d'au plus 50 microns.