SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Techniques are provided that suppress attachment of a processing liquid reflected by a guard to a main surface of a substrate, regardless of the wettability of the main surface of the substrate. This substrate processing apparatus is provided with a substrate holding unit (2), a nozzle (3), a guard...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FUJII Sadamu, TSUCHIHASHI Yuya, TAKAHASHI Mitsukazu, HONSHO Kazuhiro, ISHIKAWA Hidekazu, THEN Pohling
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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