SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE

This substrate processing method includes: preparing a substrate having a first main surface and a second main surface on the opposite side to the first main surface, the first main surface having undulations; and subjecting the first main surface of the substrate to laser processing. The substrate...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HAYAKAWA, Susumu, INOUE, Hideyuki
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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