PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

This photosensitive resin composition comprises: (A) an acid-modified vinyl group-containing resin; (B) a photopolymerization initiator; (C) a photopolymerizable compound; and (D) a polymerization inhibitor. The (B) photopolymerization initiator includes (B1) an alkylphenone-based photopolymerizatio...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAMAKAWA Arisa, YAMAGUCHI Kaho, SAWAMOTO Hayato, OYAMA Yasuyuki, YAMASHITA Naoki
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!