PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MANUFACTURING METHOD
This photosensitive resin composition contains an alkali-soluble resin (A), a polyether-modified polydimethylsiloxane (B), a solvent (C), and a photosensitizer (D). The polystyrene-equivalent weight average molecular weight (Mw) of the polyether-modified polydimethylsiloxane (B) as measured by gel p...
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| creator | HORII Makoto HIROSAWA Ryuji SUZUKI Sakiko |
| description | This photosensitive resin composition contains an alkali-soluble resin (A), a polyether-modified polydimethylsiloxane (B), a solvent (C), and a photosensitizer (D). The polystyrene-equivalent weight average molecular weight (Mw) of the polyether-modified polydimethylsiloxane (B) as measured by gel permeation chromatography is 1000-5000.
Cette composition de résine photosensible contient une résine soluble dans les alcalis (A), un polydiméthylsiloxane modifié par polyéther (B), un solvant (C) et un photosensibilisateur (D). Le poids moléculaire moyen en poids équivalent de polystyrène (Mw) du polydiméthylsiloxane modifié par polyéther (B) tel que mesuré par chromatographie par perméation de gel est de 1000 à 5000.
アルカリ可溶性樹脂（Ａ）と、ポリエーテル変性ポリジメチルシロキサン（Ｂ）と、溶剤（Ｃ）と、感光剤（Ｄ）とを含み、ポリエーテル変性ポリジメチルシロキサン（Ｂ）の、ゲルパーミエーションクロマトグラフィーによって測定される、ポリスチレン換算の重量平均分子量（Ｍｗ）が１０００以上５０００以下である、感光性樹脂組成物。 |
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Cette composition de résine photosensible contient une résine soluble dans les alcalis (A), un polydiméthylsiloxane modifié par polyéther (B), un solvant (C) et un photosensibilisateur (D). Le poids moléculaire moyen en poids équivalent de polystyrène (Mw) du polydiméthylsiloxane modifié par polyéther (B) tel que mesuré par chromatographie par perméation de gel est de 1000 à 5000.
アルカリ可溶性樹脂（Ａ）と、ポリエーテル変性ポリジメチルシロキサン（Ｂ）と、溶剤（Ｃ）と、感光剤（Ｄ）とを含み、ポリエーテル変性ポリジメチルシロキサン（Ｂ）の、ゲルパーミエーションクロマトグラフィーによって測定される、ポリスチレン換算の重量平均分子量（Ｍｗ）が１０００以上５０００以下である、感光性樹脂組成物。</description><language>eng ; fre ; jpn</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241003&DB=EPODOC&CC=WO&NR=2024204019A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241003&DB=EPODOC&CC=WO&NR=2024204019A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HORII Makoto</creatorcontrib><creatorcontrib>HIROSAWA Ryuji</creatorcontrib><creatorcontrib>SUZUKI Sakiko</creatorcontrib><title>PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MANUFACTURING METHOD</title><description>This photosensitive resin composition contains an alkali-soluble resin (A), a polyether-modified polydimethylsiloxane (B), a solvent (C), and a photosensitizer (D). The polystyrene-equivalent weight average molecular weight (Mw) of the polyether-modified polydimethylsiloxane (B) as measured by gel permeation chromatography is 1000-5000.
Cette composition de résine photosensible contient une résine soluble dans les alcalis (A), un polydiméthylsiloxane modifié par polyéther (B), un solvant (C) et un photosensibilisateur (D). Le poids moléculaire moyen en poids équivalent de polystyrène (Mw) du polydiméthylsiloxane modifié par polyéther (B) tel que mesuré par chromatographie par perméation de gel est de 1000 à 5000.
アルカリ可溶性樹脂（Ａ）と、ポリエーテル変性ポリジメチルシロキサン（Ｂ）と、溶剤（Ｃ）と、感光剤（Ｄ）とを含み、ポリエーテル変性ポリジメチルシロキサン（Ｂ）の、ゲルパーミエーションクロマトグラフィーによって測定される、ポリスチレン換算の重量平均分子量（Ｍｗ）が１０００以上５０００以下である、感光性樹脂組成物。</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwkAMgOEuDqK-Q8C1QltdHI9cagO9pFyvdSxFzkXRQn1_RHBzcfrh418mt6bSoC1Jy4F7Ak8tC6C6Rj-ikgJ2niyUXLsUqCYMXoURLPWMlIIR-8vgjHSlwdB5lhM4CpXadbK4jvc5br5dJduSAla7OD2HOE_jJT7iazhrkRWHIjtk-dHk-_-uN7btN2I</recordid><startdate>20241003</startdate><enddate>20241003</enddate><creator>HORII Makoto</creator><creator>HIROSAWA Ryuji</creator><creator>SUZUKI Sakiko</creator><scope>EVB</scope></search><sort><creationdate>20241003</creationdate><title>PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MANUFACTURING METHOD</title><author>HORII Makoto ; HIROSAWA Ryuji ; SUZUKI Sakiko</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2024204019A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>2024</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>HORII Makoto</creatorcontrib><creatorcontrib>HIROSAWA Ryuji</creatorcontrib><creatorcontrib>SUZUKI Sakiko</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HORII Makoto</au><au>HIROSAWA Ryuji</au><au>SUZUKI Sakiko</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MANUFACTURING METHOD</title><date>2024-10-03</date><risdate>2024</risdate><abstract>This photosensitive resin composition contains an alkali-soluble resin (A), a polyether-modified polydimethylsiloxane (B), a solvent (C), and a photosensitizer (D). The polystyrene-equivalent weight average molecular weight (Mw) of the polyether-modified polydimethylsiloxane (B) as measured by gel permeation chromatography is 1000-5000.
Cette composition de résine photosensible contient une résine soluble dans les alcalis (A), un polydiméthylsiloxane modifié par polyéther (B), un solvant (C) et un photosensibilisateur (D). Le poids moléculaire moyen en poids équivalent de polystyrène (Mw) du polydiméthylsiloxane modifié par polyéther (B) tel que mesuré par chromatographie par perméation de gel est de 1000 à 5000.
アルカリ可溶性樹脂（Ａ）と、ポリエーテル変性ポリジメチルシロキサン（Ｂ）と、溶剤（Ｃ）と、感光剤（Ｄ）とを含み、ポリエーテル変性ポリジメチルシロキサン（Ｂ）の、ゲルパーミエーションクロマトグラフィーによって測定される、ポリスチレン換算の重量平均分子量（Ｍｗ）が１０００以上５０００以下である、感光性樹脂組成物。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MANUFACTURING METHOD |
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