EPOXY RESIN COMPOSITION, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

To provide: an epoxy resin composition capable of suppressing small pores generated when the surface of a cured product thereof is polished; an electronic component using the epoxy resin composition; a semiconductor device using the epoxy resin composition; and a method for manufacturing the semicon...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OE Takayuki, SAITO Yu, KAMIMURA Tsuyoshi
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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