LOW TEMPERATURE CURABLE ONE COMPONENT EPOXY COMPOSITIONS CONTAINING RESIN-BLOCKED UREA CURATIVES

The present disclosure provides for latent curing accelerators as well as compositions containing such a latent curing accelerator with a substance to be cured (e.g., an epoxy resin). The latent curing accelerators comprise a urea compound and an encapsulant system having a polyphenol resin and/or a...

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Bibliographische Detailangaben
Hauptverfasser:	LA COMARE, Douglas M, ROUMPELAKIS, Emmanouil, FAZEL, Shafiq, LAL, Gauri Sankar, HARTMANN, John
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present disclosure provides for latent curing accelerators as well as compositions containing such a latent curing accelerator with a substance to be cured (e.g., an epoxy resin). The latent curing accelerators comprise a urea compound and an encapsulant system having a polyphenol resin and/or at least one additional excipient. Methods of making and use are further provided. La présente invention concerne des accélérateurs de durcissement latent ainsi que des compositions contenant un tel accélérateur de durcissement latent avec une substance à durcir (par exemple, une résine époxy). Les accélérateurs de durcissement latent comprennent un composé d'urée et un système d'encapsulation ayant une résine de polyphénol et/ou au moins un excipient supplémentaire. L'invention concerne en outre des procédés de fabrication et d'utilisation.