MAINBOARD SYSTEM, HEAT DISSIPATION SYSTEM AND ELECTRONIC DEVICE
The embodiments of the present application belong to the technical field of electronic devices. Provided are a heat dissipation system, a mainboard system and an electronic device. The mainboard system comprises a substrate assembly, a heat conduction member and a heat dissipation member, which are...
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Zusammenfassung: | The embodiments of the present application belong to the technical field of electronic devices. Provided are a heat dissipation system, a mainboard system and an electronic device. The mainboard system comprises a substrate assembly, a heat conduction member and a heat dissipation member, which are stacked, wherein the substrate assembly comprises a substrate, a heating device electrically connected to the substrate being provided on one side of the substrate; the heat conduction member is arranged on the side of the substrate facing away from the heating device, is connected to the substrate and is used for conducting heat generated by the heating device; and the heat dissipation member is arranged on the same side of the heat conduction member as the substrate, and is used for conducting the heat generated by the heating device to the outside of the mainboard system.
Les modes de réalisation de la présente demande relèvent du domaine technique des dispositifs électroniques. L'invention concerne un système d |
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