PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE

The present application relates to the technical field of circuit boards, and provides a printed circuit board and an electronic device, for use in solving the technical problem of high cost caused by a large number of stack layers of a printed circuit board. The printed circuit board comprises: a first wiring layer; a dielectric layer, which is stacked with the first wiring layer; a second wiring layer, arranged on the side of the dielectric layer away from the first wiring layer; a signal line, arranged on one of the first wiring layer and the second wiring layer, the signal line comprising a plurality of groups of signal wires, and ground enclosure lines being symmetrically arranged on two sides of each group of signal wires, respectively; a grounding plane, arranged on the other one of the second wiring layer and the first wiring layer, wherein the grounding plane and the signal line are located on different surfaces; and a via hole, the via hole sequentially passing through the first wiring layer, the di