MANUFACTURING METHOD FOR PRINTED WIRING BOARD

[PROBLEM] To provide a manufacturing method for a printed wiring board from which smears can be satisfactorily removed. [SOLUTION] This manufacturing method for a printed wiring board includes, in the following order: a multilayer board forming step for forming a multilayer board 14 by laminating, o...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KAWASHITA Kazuaki, SATO Toshinori, KAIMORI Yoshiyasu, KAWAI Hidetoshi, KITAMURA Shinya
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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