MEMORY, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE

The present disclosure relates to the technical field of integrated circuit design and manufacturing, and particularly relates to a semiconductor structure, a manufacturing method therefor, a memory, and an electronic device, which are used for solving the technical problem of hole defects or slit d...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TIAN, Chao, MENG, Jingheng, PING, Yanlei
Format:	Patent
Sprache:	chi ; eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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