THE COMPOSITION AND THERMAL CURABLE ADHESIVE FILM DERIVED THEREOF

A composition and a thermal curable adhesive film derived thereof. The thermal curable adhesive film can be activatable at low temperature (lower than 100℃, preferably from 60℃ to 80℃) and is capable of being self-supported and exhibiting excellent bonding strength when cured. L'invention conce...

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Bibliographische Detailangaben
Hauptverfasser:	LUO, Yizhong, SHEN, Dongmei
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A composition and a thermal curable adhesive film derived thereof. The thermal curable adhesive film can be activatable at low temperature (lower than 100℃, preferably from 60℃ to 80℃) and is capable of being self-supported and exhibiting excellent bonding strength when cured. L'invention concerne une composition et un film adhésif thermodurcissable dérivé de celle-ci. Le film adhésif thermodurcissable peut être activé à basse température (inférieure à 100°C, de préférence de 60°C à 80°C) et peut être autosupporté et présenter une excellente force de liaison lorsqu'il est durci.