POLYETHYLENE COMPOSITION FOR INSULATION LAYER

The present disclosure is directed to a composition. In an embodiment, the composition includes (A) a base bimodal ethylene/C4-C8 α-olefin copolymer. The base bimodal ethylene/C4- C8 α-olefin copolymer has (i) a density from 0.91 g/cc to 0.93 g/cc, (ii) an I21/l2 from 90 to 140, (iii) a Mw/Mn from 7...

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Bibliographische Detailangaben

Hauptverfasser:	BRIGANDI, Paul J, HEITSCH, Andrew T, PETR, Michael T, ESSEGHIR, Mohamed, GINGER, Doug S
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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