POLYETHYLENE COMPOSITION FOR INSULATION LAYER

POLYETHYLENE COMPOSITION FOR INSULATION LAYER

The present disclosure is directed to a composition. In an embodiment, the composition includes (A) a base bimodal ethylene/C4-C8 α-olefin copolymer. The base bimodal ethylene/C4- C8 α-olefin copolymer has (i) a density from 0.91 g/cc to 0.93 g/cc, (ii) an I21/l2 from 90 to 140, (iii) a Mw/Mn from 7...

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Hauptverfasser: BRIGANDI, Paul J, HEITSCH, Andrew T, PETR, Michael T, ESSEGHIR, Mohamed, GINGER, Doug S
Format: Patent
Sprache:eng ; fre
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CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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creator BRIGANDI, Paul J
HEITSCH, Andrew T
PETR, Michael T
ESSEGHIR, Mohamed
GINGER, Doug S
description The present disclosure is directed to a composition. In an embodiment, the composition includes (A) a base bimodal ethylene/C4-C8 α-olefin copolymer. The base bimodal ethylene/C4- C8 α-olefin copolymer has (i) a density from 0.91 g/cc to 0.93 g/cc, (ii) an I21/l2 from 90 to 140, (iii) a Mw/Mn from 7.0 to 15.0, (iv) an Mz less than 600,000 g/mol, (v) an SHI (η0.1/η100) value from 5.0 to 30.0, (vi) from 0 ppb to 80 ppb boron, and (vii) from 0 ppm to 5 ppm of fluorine. The composition is suitable as an insulation layer on a cable. La présente divulgation concerne une composition. Dans un mode de réalisation, la composition comprend (A) un copolymère d'éthylène/α-oléfine en C4-C8 bimodal de base. Le copolymère d'éthylène/α-oléfine en C4- C8 bimodal de base a (i) une densité de 0,91 g/cc à 0,93 g/cc, (ii) un I21/l2 de 90 à 140, (iii) un Mw/Mn de 7,0 à 15,0, (iv) un Mz inférieur à 600 000 g/mol, (v) une valeur SHI (η0,1/η100) de 5,0 à 30,0, (vi) de 0 ppb à 80 ppb de bore, et (vii) de 0 ppm à 5 ppm de fluor. La composition est appropriée en tant que couche d'isolation sur un câble.
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In an embodiment, the composition includes (A) a base bimodal ethylene/C4-C8 α-olefin copolymer. The base bimodal ethylene/C4- C8 α-olefin copolymer has (i) a density from 0.91 g/cc to 0.93 g/cc, (ii) an I21/l2 from 90 to 140, (iii) a Mw/Mn from 7.0 to 15.0, (iv) an Mz less than 600,000 g/mol, (v) an SHI (η0.1/η100) value from 5.0 to 30.0, (vi) from 0 ppb to 80 ppb boron, and (vii) from 0 ppm to 5 ppm of fluorine. The composition is suitable as an insulation layer on a cable. La présente divulgation concerne une composition. Dans un mode de réalisation, la composition comprend (A) un copolymère d'éthylène/α-oléfine en C4-C8 bimodal de base. Le copolymère d'éthylène/α-oléfine en C4- C8 bimodal de base a (i) une densité de 0,91 g/cc à 0,93 g/cc, (ii) un I21/l2 de 90 à 140, (iii) un Mw/Mn de 7,0 à 15,0, (iv) un Mz inférieur à 600 000 g/mol, (v) une valeur SHI (η0,1/η100) de 5,0 à 30,0, (vi) de 0 ppb à 80 ppb de bore, et (vii) de 0 ppm à 5 ppm de fluor. 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La composition est appropriée en tant que couche d'isolation sur un câble.</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAN8PeJdA3xiPRx9XNVcPb3DfAP9gzx9PdTcPMPUvD0Cw71cQRzfRwjXYN4GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakl8uL-RgZGJobm5hYGho6ExcaoAkZcm5A</recordid><startdate>20240829</startdate><enddate>20240829</enddate><creator>BRIGANDI, Paul J</creator><creator>HEITSCH, Andrew T</creator><creator>PETR, Michael T</creator><creator>ESSEGHIR, Mohamed</creator><creator>GINGER, Doug S</creator><scope>EVB</scope></search><sort><creationdate>20240829</creationdate><title>POLYETHYLENE COMPOSITION FOR INSULATION LAYER</title><author>BRIGANDI, Paul J ; HEITSCH, Andrew T ; PETR, Michael T ; ESSEGHIR, Mohamed ; GINGER, Doug S</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2024177801A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2024</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>BRIGANDI, Paul J</creatorcontrib><creatorcontrib>HEITSCH, Andrew T</creatorcontrib><creatorcontrib>PETR, Michael T</creatorcontrib><creatorcontrib>ESSEGHIR, Mohamed</creatorcontrib><creatorcontrib>GINGER, Doug S</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BRIGANDI, Paul J</au><au>HEITSCH, Andrew T</au><au>PETR, Michael T</au><au>ESSEGHIR, Mohamed</au><au>GINGER, Doug S</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLYETHYLENE COMPOSITION FOR INSULATION LAYER</title><date>2024-08-29</date><risdate>2024</risdate><abstract>The present disclosure is directed to a composition. In an embodiment, the composition includes (A) a base bimodal ethylene/C4-C8 α-olefin copolymer. The base bimodal ethylene/C4- C8 α-olefin copolymer has (i) a density from 0.91 g/cc to 0.93 g/cc, (ii) an I21/l2 from 90 to 140, (iii) a Mw/Mn from 7.0 to 15.0, (iv) an Mz less than 600,000 g/mol, (v) an SHI (η0.1/η100) value from 5.0 to 30.0, (vi) from 0 ppb to 80 ppb boron, and (vii) from 0 ppm to 5 ppm of fluorine. The composition is suitable as an insulation layer on a cable. La présente divulgation concerne une composition. Dans un mode de réalisation, la composition comprend (A) un copolymère d'éthylène/α-oléfine en C4-C8 bimodal de base. Le copolymère d'éthylène/α-oléfine en C4- C8 bimodal de base a (i) une densité de 0,91 g/cc à 0,93 g/cc, (ii) un I21/l2 de 90 à 140, (iii) un Mw/Mn de 7,0 à 15,0, (iv) un Mz inférieur à 600 000 g/mol, (v) une valeur SHI (η0,1/η100) de 5,0 à 30,0, (vi) de 0 ppb à 80 ppb de bore, et (vii) de 0 ppm à 5 ppm de fluor. 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subjects CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
title POLYETHYLENE COMPOSITION FOR INSULATION LAYER
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