HEAT DISSIPATION DEVICE, HEAT DISSIPATION SYSTEM, HEAT DISSIPATION DEVICE CONTROL METHOD, AND DATA CENTER

The present application relates to the technical field of data centers, and provides a heat dissipation device, a heat dissipation system, a heat dissipation device control method, and a data center. The heat dissipation device comprises: a housing, fans being provided in the housing, so that heat d...

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Bibliographische Detailangaben
1. Verfasser:	REN, Huahua
Format:	Patent
Sprache:	chi ; eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present application relates to the technical field of data centers, and provides a heat dissipation device, a heat dissipation system, a heat dissipation device control method, and a data center. The heat dissipation device comprises: a housing, fans being provided in the housing, so that heat dissipation air ducts are formed in the housing; heat dissipation coiled tubes provided in the heat dissipation air ducts, a cooling liquid flow channel allowing a first cooling liquid to flow being defined inside each heat dissipation coiled tube; isenthalpic humidifiers provided in the heat dissipation air ducts, in the direction of flow of air in the heat dissipation air ducts, the isenthalpic humidifiers being located upstream of the heat dissipation coiled tubes; and liquid sprayers provided in the heat dissipation air ducts, in the direction of flow of air in the heat dissipation air ducts, the liquid sprayers being located downstream of the isenthalpic humidifiers, wherein when the heat dissipation device is