METHODS AND SYSTEMS OF A PRINTED CIRCUIT ON A SUBSTRATE FOR STRETCHABLE ELECTRONICS
A method for fabricating a flexible or stretchable printed circuit may include: providing a substrate comprising a polyethylene terephthalate (PET) support layer, a thermoplastic urethane (TPU) layer; and a hotmelt adhesive (HMA) layer disposed between the PET layer and the TPU layer; pre-shrinking...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | MASTROPIETRO, Michael Alan BAMBACH, Andrew John TIBBETTS, Marshall Campion |
| description | A method for fabricating a flexible or stretchable printed circuit may include: providing a substrate comprising a polyethylene terephthalate (PET) support layer, a thermoplastic urethane (TPU) layer; and a hotmelt adhesive (HMA) layer disposed between the PET layer and the TPU layer; pre-shrinking the substrate; and printing a resistive layer on the TPU layer of the substrate, and printing an insulative layer on the resistive layer, removing the PET support layer; and transferring a portion of the substrate to a flexible or stretchable layer.
L'invention concerne un procédé de fabrication d'un circuit imprimé souple ou étirable qui peut consister à : fournir un substrat comprenant une couche de support en polyéthylène téréphtalate (PET), une couche d'uréthane thermoplastique (TPU); et une couche d'adhésif thermofusible (HMA) disposée entre la couche de PET et la couche de TPU; pré-rétrécir le substrat; et imprimer une couche résistive sur la couche de TPU du substrat, et imprimer une couche isolante sur la couche résistive, retirer la couche de support de PET; et transférer une partie du substrat à une couche souple ou étirable. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2024167943A9</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2024167943A9</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2024167943A93</originalsourceid><addsrcrecordid>eNqNikEKwjAQAHPxIOofFjwL2halxzTZ0ECblewW8VSKxJNoof4fK_gATzMMs1TcotRkGXSwwFcWbBnIgYZz9EHQgvHRdF6Awhy5q1iiFgRHEWZFMbWuGgRs0Eik4A2v1eI-PKa0-XGltu777dL46tM0Drf0TO_-Qtk-Kw7HU1nkusz_uz6wojDS</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHODS AND SYSTEMS OF A PRINTED CIRCUIT ON A SUBSTRATE FOR STRETCHABLE ELECTRONICS</title><source>esp@cenet</source><creator>MASTROPIETRO, Michael Alan ; BAMBACH, Andrew John ; TIBBETTS, Marshall Campion</creator><creatorcontrib>MASTROPIETRO, Michael Alan ; BAMBACH, Andrew John ; TIBBETTS, Marshall Campion</creatorcontrib><description>A method for fabricating a flexible or stretchable printed circuit may include: providing a substrate comprising a polyethylene terephthalate (PET) support layer, a thermoplastic urethane (TPU) layer; and a hotmelt adhesive (HMA) layer disposed between the PET layer and the TPU layer; pre-shrinking the substrate; and printing a resistive layer on the TPU layer of the substrate, and printing an insulative layer on the resistive layer, removing the PET support layer; and transferring a portion of the substrate to a flexible or stretchable layer.
L'invention concerne un procédé de fabrication d'un circuit imprimé souple ou étirable qui peut consister à : fournir un substrat comprenant une couche de support en polyéthylène téréphtalate (PET), une couche d'uréthane thermoplastique (TPU); et une couche d'adhésif thermofusible (HMA) disposée entre la couche de PET et la couche de TPU; pré-rétrécir le substrat; et imprimer une couche résistive sur la couche de TPU du substrat, et imprimer une couche isolante sur la couche résistive, retirer la couche de support de PET; et transférer une partie du substrat à une couche souple ou étirable.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CONDUCTORS ; ELECTRICITY ; INSULATORS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241010&DB=EPODOC&CC=WO&NR=2024167943A9$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241010&DB=EPODOC&CC=WO&NR=2024167943A9$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MASTROPIETRO, Michael Alan</creatorcontrib><creatorcontrib>BAMBACH, Andrew John</creatorcontrib><creatorcontrib>TIBBETTS, Marshall Campion</creatorcontrib><title>METHODS AND SYSTEMS OF A PRINTED CIRCUIT ON A SUBSTRATE FOR STRETCHABLE ELECTRONICS</title><description>A method for fabricating a flexible or stretchable printed circuit may include: providing a substrate comprising a polyethylene terephthalate (PET) support layer, a thermoplastic urethane (TPU) layer; and a hotmelt adhesive (HMA) layer disposed between the PET layer and the TPU layer; pre-shrinking the substrate; and printing a resistive layer on the TPU layer of the substrate, and printing an insulative layer on the resistive layer, removing the PET support layer; and transferring a portion of the substrate to a flexible or stretchable layer.
L'invention concerne un procédé de fabrication d'un circuit imprimé souple ou étirable qui peut consister à : fournir un substrat comprenant une couche de support en polyéthylène téréphtalate (PET), une couche d'uréthane thermoplastique (TPU); et une couche d'adhésif thermofusible (HMA) disposée entre la couche de PET et la couche de TPU; pré-rétrécir le substrat; et imprimer une couche résistive sur la couche de TPU du substrat, et imprimer une couche isolante sur la couche résistive, retirer la couche de support de PET; et transférer une partie du substrat à une couche souple ou étirable.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CONDUCTORS</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNikEKwjAQAHPxIOofFjwL2halxzTZ0ECblewW8VSKxJNoof4fK_gATzMMs1TcotRkGXSwwFcWbBnIgYZz9EHQgvHRdF6Awhy5q1iiFgRHEWZFMbWuGgRs0Eik4A2v1eI-PKa0-XGltu777dL46tM0Drf0TO_-Qtk-Kw7HU1nkusz_uz6wojDS</recordid><startdate>20241010</startdate><enddate>20241010</enddate><creator>MASTROPIETRO, Michael Alan</creator><creator>BAMBACH, Andrew John</creator><creator>TIBBETTS, Marshall Campion</creator><scope>EVB</scope></search><sort><creationdate>20241010</creationdate><title>METHODS AND SYSTEMS OF A PRINTED CIRCUIT ON A SUBSTRATE FOR STRETCHABLE ELECTRONICS</title><author>MASTROPIETRO, Michael Alan ; BAMBACH, Andrew John ; TIBBETTS, Marshall Campion</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2024167943A93</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CONDUCTORS</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><toplevel>online_resources</toplevel><creatorcontrib>MASTROPIETRO, Michael Alan</creatorcontrib><creatorcontrib>BAMBACH, Andrew John</creatorcontrib><creatorcontrib>TIBBETTS, Marshall Campion</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MASTROPIETRO, Michael Alan</au><au>BAMBACH, Andrew John</au><au>TIBBETTS, Marshall Campion</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHODS AND SYSTEMS OF A PRINTED CIRCUIT ON A SUBSTRATE FOR STRETCHABLE ELECTRONICS</title><date>2024-10-10</date><risdate>2024</risdate><abstract>A method for fabricating a flexible or stretchable printed circuit may include: providing a substrate comprising a polyethylene terephthalate (PET) support layer, a thermoplastic urethane (TPU) layer; and a hotmelt adhesive (HMA) layer disposed between the PET layer and the TPU layer; pre-shrinking the substrate; and printing a resistive layer on the TPU layer of the substrate, and printing an insulative layer on the resistive layer, removing the PET support layer; and transferring a portion of the substrate to a flexible or stretchable layer.
L'invention concerne un procédé de fabrication d'un circuit imprimé souple ou étirable qui peut consister à : fournir un substrat comprenant une couche de support en polyéthylène téréphtalate (PET), une couche d'uréthane thermoplastique (TPU); et une couche d'adhésif thermofusible (HMA) disposée entre la couche de PET et la couche de TPU; pré-rétrécir le substrat; et imprimer une couche résistive sur la couche de TPU du substrat, et imprimer une couche isolante sur la couche résistive, retirer la couche de support de PET; et transférer une partie du substrat à une couche souple ou étirable.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre |
| recordid | cdi_epo_espacenet_WO2024167943A9 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY INSULATORS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES |
| title | METHODS AND SYSTEMS OF A PRINTED CIRCUIT ON A SUBSTRATE FOR STRETCHABLE ELECTRONICS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-12T01%3A56%3A31IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MASTROPIETRO,%20Michael%20Alan&rft.date=2024-10-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EWO2024167943A9%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |