ELECTRONIC DEVICE COOLING STRUCTURES

A cooling structure having a first side and a second side opposite the first side can be formed through a method comprising, forming an inlet and an outlet in a first substrate, forming at least one channel on the second side of the first substrate, wherein the at least one channel is in fluid commu...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HABA, Belgacem, ZHANG, Ron, BANG, Kyong-Mo, FOUNTAIN, Gaius, WORKMAN, Thomas
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!