FORMATION OF METALLIC FILMS ON ELECTROLESS METAL PLATING OF SURFACES

Embodiments of the disclosure relate to articles, coated chamber components, and techniques of coating chamber components and systems. In particular, disclosed is a chamber component and methods of forming the chamber component that includes a substrate and a first layer disposed on the substrate, t...

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Bibliographische Detailangaben
Hauptverfasser:	JORGENSEN, David John, BEAUDRY, Christopher Laurent, SHULL, Marc, LIU, Chao, BEHNKE, Joseph Frederick
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Embodiments of the disclosure relate to articles, coated chamber components, and techniques of coating chamber components and systems. In particular, disclosed is a chamber component and methods of forming the chamber component that includes a substrate and a first layer disposed on the substrate, the first layer including a metal with a first atomic concentration. The chamber component further includes a second layer disposed on the first layer, the second layer including the metal with a second atomic concentration that is at least 5 percent higher than the first atomic concentration. Des modes de réalisation de la divulgation concernent des articles, des composants de chambre revêtus et des techniques de revêtement de composants et de systèmes de chambre. En particulier, la divulgation concerne un composant de chambre et des procédés de formation du composant de chambre qui comprend un substrat et une première couche disposée sur le substrat, la première couche comprenant un métal ayant une première concentration atomique. Le composant de chambre comprend en outre une seconde couche disposée sur la première couche, la seconde couche comprenant le métal avec une seconde concentration atomique qui est supérieure d'au moins 5 pour cent à la première concentration atomique.