INTEGRATED CIRCUIT PACKAGE, SYSTEM COMPRISING PRINTED CIRCUIT BOARD AND INTEGRATED CIRCUIT PACKAGE, METHOD OF SOLDERING INTEGRATED CIRCUIT PACKAGE TO PRINTED CIRCUIT BOARD

An integrated circuit package with a package connector and at least three bottom-most points of the package that define a seating plane, wherein the shortest distance between the seating plane and the package connector solder surface is at least 6 mils (0.152 mm). A printed circuit board comprising...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OCAMPO, Adrian, TU, Benson, WANG, Zhiyang, KWOK, Bianca
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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